AWG G3 PAD FOR PS3 Spezifikationen PDF herunterladen (Seite 62)

4 Test Head Filling and DUT Board Considerations DUT Board Mechanical Considerations

62 System Reference, January 2001

Instead of

•a packaged parts DUT board ,

where the devices under test are placed directly on the

DUT board,

•a wafer prober DUT board

can be placed on top of the DUT interface followed by

several further components as illustrated in Figure 45 on

page 104.

For an overview of wafer prober DUT boards see “Wafer

Prober DUT Board and Probe Card” on page 104.

Overview of DUT Board Options

With the 512 pin and the 1024 pin version of the tester you

have the following DUT board options:

• On the 1024 pin test head you will normally use a 1024

pin SOC Series DUT board but you can use a 512 pin

SOC Series DUT board aswell.

•On the 512 pin test head you will normally use a 512

pin SOC Series DUT board. You can also reuse an

Agilent 83000 F330 DUT board with this test head but

only in combination with an F330-Style DUT interface.

• For engineering samples Agilent supports 256 pin SOC

Series DUT boards for both the 512 pin and the 1024

pin test head. See “Possible 256 pin DUT boards for

either the 512 pin test head or the 1024 pin test head”

on page 66 for detail on which sections of the 1024 pin

DUT board can be used as 256 pin DUT boards. NOTE

that you can’t use the 256 pin DUT board for produc-

tion since it is impossible to place the handler that has

to be located in the center of the test heads on any 256

pin DUT board.

Figure 30 shows which of the three optional DUT boards

fits which version of the SOC series tester.

1 2 ... 57 58 59 60 61 62 63 64 65 66 67 ... 284 285

Keine Kommentare

AWG G3 PAD FOR PS3 Spezifikationen Seite 62